1.異常判定基準簡述? 一，基板表面氧化。 二，線寬線距不足不良

1.異常判定基準簡述?

一，基板表面氧化。
二，線寬線距不足不良超過3%。
三，報點超過50點。
四，基板變形(板彎)。
五，孔偏嚴重(破孔)。
六，剝膜殘超過 2枚。
七，基板混料。


2.異常處置程序簡述?

一，發現製品異常暫停投入生產。
二，異常內容向製造部主管回報。
三，向品證部門申請開立異常批處置連絡單。
四，招集相關部門討論決議異常內容處置方式。
五，針對異常LOT及不良項目100%加強檢查。

結果 (英文) 2:

1. Description of the abnormality judgment reference? a, the substrate surface oxidation. Second, the line width from less than 3% bad. Third, the report points more than 50 points. Fourth, the deformation of the substrate (plate bending). Five holes partial severe (broken hole). Sixth, stripping residue over two. Seven mixing board. 2. Exceptional handling procedures outlined? First, find articles abnormal pauses in production. Second, the abnormal content director returns to the manufacturing department. Third, the product license application to open a department liaison single exception granted disposal. Fourth, the recruiting departments to discuss the contents of the resolution abnormal disposition. Fifth, strengthen the inspection for abnormalities and adverse LOT project 100%.

結果 (英文) 3:

1 anomaly judgment benchmark?

1, substrate surface oxidation.
two, line spacing is less than 3%.
three, at points over 50 points.
four, substrate deformation (Ban Wan).
five, Kong Pian (six).

A, it is found that the product abnormal suspend investment production.
2, abnormal content to manufacturing department supervisor return.
3, to product certificate authorities for open aberrant batch disposal contact.
4, convened a meeting of the relevant departments to discuss resolution abnormal content disposition way.
5, for abnormal lot and bad project 100% strengthen inspection.