晶片翻轉位置(Cassette上方)，疑似晶片未完全抽離Slot即翻轉

晶片翻轉位置(Cassette上方)，疑似晶片未完全抽離Slot即翻轉晶片導致晶片與Slot產生阻力造成吸筆掉落。

結果 (英文) 1:

Wafer flip position (Cassette above), the wafer is not completely detached suspected Slot i.e. flip chip
lead wafer Slot generation caused by a resistance fall wand.

結果 (英文) 2:

Chip flip position (above Cassette), suspected chip does not completely pull out of Slot, flip spevened chip
Causes the chip to have resistance to Slot and cause the pen to drop.

結果 (英文) 3:

Chip flip position (above the cassette). If the suspected chip is not completely pulled out of the slot, it will flip the chip
The resistance between chip and slot causes the pen to fall.