1.聯京光電是由聯電新投資事業，於2010年8月23日所成立的LED專

1.聯京光電是由聯電新投資事業，於2010年8月23日所成立的LED專業封裝公司。
2.公司從早期銅基板散熱製程的高功率封裝， 進程到CSP(Chip Scale Package)小尺寸高功率
的封裝技術，到近期運用CSP製程， 與客戶共同開發銷售應用在汽車/機車/自行車尾燈的平面
光源產品。

3.未來公司將持續提昇LED封裝應用技術， 並整合功能性IC，擴大在「安全性應用產品」的開
發及市場銷售。

Ⓞ公司完整簡介說明：

結果 (英文) 1:

1. Optical is a joint Beijing UMC new business investment, in August 23, 2010 the establishment of the professional LED packaging company.
2. company from the early copper substrate cooling process high power packages, a process to CSP (Chip Scale Package) small-size high-power
packaging technology, the recent use of CSP process, together with the customer to develop and sell applications in automotive / motorcycle / bicycle taillight planar
light products.

3. The future of the company will continue to enhance the application of LED packaging technology, and integration of the IC, expand open "Security applications" of
fat and marketing.

Complete Introduction Ⓞ Company Description:

結果 (英文) 2:

1. Lianjing Optoelectronics is a new investment business by the United Electric Power, on August 23, 2010 set up LED professional packaging company.
2. The company from the early copper substrate cooling process of high-power package, process to CSP (Chip Scale Package) small size high power
Packaging technology, to the recent use of CSP process, with customers to develop sales applications in the car / locomotive / bicycle tail light plane

Light source products.
3. In the future, the company will continue to upgrade LED packaging application technology, and integrate functional ICs to expand the opening of "security application products"

marketing and marketing. (O) Company's complete introduction:

結果 (英文) 3:

1. Lianjing optoelectronics is a professional LED packaging company established on August 23, 2010 by liandian new investment enterprise.
2. From the high-power packaging of the early copper substrate heat dissipation process to the small-scale high-power CSP (chip scale package)
In recent years, CSP process will be used to develop and sell taillights for automobiles / Motorcycles / bicycles together with customers.
Light source products.
3. In the future, the company will continue to improve LED packaging application technology, integrate functional IC, and expand the development of "security application products"
Development and marketing.
Ⓞ full company profile: