為了使風扇連接器端子與Wafer更好的接觸.建議變更端子料厚由T=0.

為了使風扇連接器端子與Wafer更好的接觸.建議變更端子料厚由T=0.15mm彈片式，更換為T=0.2mm凸點式的端子。

結果 (英文) 1:

For the fan to the connector terminal Wafer better contact with
proposed changes in the contact material thickness T = 0.15mm shrapnel, T = 0.2mm replaced bumped terminal.

結果 (英文) 2:

In order to make the fan connector terminals in better contact with Wafer.
It is recommended to change the terminal thickness from T-0.15mm shrapnel type and replaced with a T-0.2mm convex terminal.

結果 (英文) 3:

In order to make better contact between fan connector terminal and wafer
It is suggested to change the thickness of terminal material from t = 0.15mm spring type to t = 0.2mm bump type.